Friday, November 18, 2005
Physics and Chemistry of Atmospheric Pressure Plasmas for Materials Processing
Robert F. Hicks
Chemical and Biomolecular Engineering Department, UCLA
Atmospheric pressure plasmas are of great interest for materials processing, since they provide a way to clean, activate, etch or deposit coatings on practically any surface without the need for expensive or specialized equipment. In this presentation, a review will be given of the main types of atmospheric pressure plasmas: dielectric barrier discharges, thermal torches, and capacitive discharges. Then, the physics and chemistry of a new capacitive discharge source developed at UCLA will be described. This plasma is generated by flowing inert gas and up to 3.0 volume % gas molecules through two closely spaced metal electrodes that are driven with radio frequency power. The new plasma source is unique in that it produces a high concentration of radicals, e.g., O atoms, which can be used to etch or deposit thin films at high speeds, up to 2.0 microns per second.
Refreshments at 4:00 PM. Seminar begins at 4:10 PM.
Building 8 (Science Bldg.) - Room 241
For further information, please call (909) 869-4014